Advanced Thermal Solutions TLC-100™ Thermochromic Liquid Crystal Kit

Advanced Thermal Solutions TLC-100™ Thermochromic Liquid Crystal Kit is designed for heat transfer studies and mapping temperature fields on electronic components or boards. The TLC-100™ features thermochromic liquid crystals (TLCs), which change color at a specified temperature starting at red, changing to green, then blue. For electronics cooling applications, this provides the user with accurate information about the location of hot spots on a device, their temperature, and temperature gradient.

To map the temperature profile of a component or board, black ink is airbrushed on to the specimen. Then, TLCs with a particular temperature range (depending on the application), are sprayed onto the measurement surface. Once the device is turned on and the components are brought to activation temperature, the liquid crystals will begin turning red, then into different colors, representing the temperature distribution of the component or board. Black ink and TLCs are non-destructive and wash off with soap and water. Thermochromic liquid crystals from Advanced Thermal Solutions are available in various temperature ranges from +20°C to +120°C, each with a particular bandwidth from 1 to +20°C.


  • The comprehensive kit includes everything required for thermal mapping, right out of the box.
  • Can be used for measurements at both the component and board-level.

Kit Contents

  • An airbrush for coating the component or board’s surface with black backing ink and liquid crystals
  • Air hose with couplings, valve for propellant cans, and a 1/4” pipe adapter for use with an air compressor
  • Two 30ml bottles of Thermochromic Liquid Crystals (temperature ranges specified when ordering)
  • One 30ml bottle of sprayable black backing ink for pre-treating the surface to be studied
  • Two glass jars, which attach to the airbrush, for dispensing ink and liquid crystals
  • Two portable and disposable, 340g (12 oz.) cans of CFC-free air propellant. (US only)


  • Heat mapping studies
  • Component temperature testing
  • PCB testing
  • Hot Spot and defect identification
Publicado: 2019-11-25 | Actualizado: 2023-04-03